Thermal Management: The Importance of Managing Heat in Electronic Applications
Leave a CommentAs electronic devices become more powerful and compact, heat generation is a significant concern. Excessive heat threatens the reliability and longevity of electronic devices and components. This is where effective thermal management plays a crucial role. Thermal management involves using thermally conductive materials, such as epoxy resins, to manage and dissipate heat in electronic components, ensuring devices operate within safe temperature ranges to maintain reliable mechanical and thermal performance and longevity. Encapsulant materials with high thermal conductivity are crucial for effective thermal management in electronics packaging and devices. Thermal management applications include encapsulation and potting, adhesives, and coatings.
This blog explores the benefits of epoxy as a thermal management material and key considerations to consider when choosing an epoxy system for your application.
The Role of Epoxy Resin in Thermal Management
Epoxy resin is a thermosetting polymer material commonly used for various applications within electronic devices and assemblies. Its key thermo-mechanical properties play an important role in the performance and reliability of electronics packaging and devices to ensure proper thermal management:
1. High Insulation Performance
Epoxy resin is known for its exceptional insulation properties. It provides a barrier against electrical currents, which helps prevent short circuits and electrical malfunctions to ensure the reliability and safety of electronic devices, while managing heat dissipation. Epoxy has excellent thermal stability and can withstand high temperatures without degradation. Heat in excess of the intended operating temperature range can cause immediate catastrophic failure or eventual failure of the electronic component or device, as well as potential degradation of the epoxy, leading to loss of mechanical strength and adhesion properties. By keeping safe temperature ranges with effective thermal management, such failures or degradation may be avoided, and the potential for fire is reduced.
2. Enhanced Thermal Conductivity
Epoxy resin is formulated with thermally conductive fillers, such as aluminum oxide, boron nitride, copper, silver, graphite, or composites, to enhance its thermal conductivity. Heat is transferred by conduction when adjacent atoms vibrate against one another, or as electrons move from one atom to another. Conduction is the most significant means of heat transfer within a solid or between solid objects in thermal contact. The filler conducts heat away from the source, creating continuous pathways for the heat to travel from hot areas to cooler areas, thereby protecting the device from overheating and potential failure. In short, improved thermal conductivity facilitates high heat dissipation through the efficient transfer of heat away from electronic components, mitigating the risk of overheating and ensuring optimal performance and longevity.
3. High Mechanical Strength with Increased Durability
Epoxies are two-part thermosetting polymers composed of a resin, typically bisphenol-A (BPA) or bisphenol-F (BPF), or epoxy novolac, and an amine hardener. A chemical reaction, polymerization (curing), is initiated when the resin is mixed with a hardener (sometimes referred to as a catalyst). Epoxy resins form crosslinks during this process, creating a three-dimensional polymer network of great mechanical strength. The chemical composition of epoxy resin creates a strong, durable material with high mechanical strength suitable for electronic applications. Epoxy resin provides mechanical support to delicate electronic components, protecting components from physical damage and ensuring their longevity under various operating conditions.
4. Improved User Experience
Excessive heat can make electronic devices uncomfortable to use, or too hot to handle, as well as impact their performance. Thermal management maintains comfortable device use and device functionality by protecting from excessive heat.
Key Factors in Selecting Thermal Management Materials
When selecting thermal management material for a particular application, the specific thermal, mechanical, electrical, and environmental requirements of the application must be considered. The key factors include:
Heat Dissipation
Excessive heat or thermal stress can degrade electronic components and devices and reduce their lifespan. The specific heat dissipation needs of an application will determine the type of epoxy resin and filler materials required. Higher heat loads may necessitate materials with superior thermal conductivity. The epoxy must efficiently dissipate the heat generated by the electronic component or device or other heat source. The encapsulation of electronic components with thermally conductive epoxy can dissipate heat generated by the components more effectively, to reduce the risk of thermal damage by maintaining a uniform temperature.
Adhesive Requirements
Epoxy resins provide strong adhesion to various substrates, including metals, plastics, and ceramics. This ensures reliable bonding and thermal transfer between components and is particularly important in applications where materials must withstand vibrations and mechanical stress. The epoxy must have the mechanical strength and flexibility to endure any mechanical stress or thermal cycling to which it is subjected, without degradation or failure.
Mechanical stresses or failure can be caused by differences in coefficients of thermal expansion (CTE) of the epoxy and that of the electronic components and substrates in the electronic packaging. Thermal stress related failures due to CTE mismatch are particularly an issue for high power devices. Matching the coefficient of thermal expansion for the component to that of the substrate to that of the epoxy reduces thermally induced stresses and minimizes the risk of failure or delamination.
Viscosity
The viscosity of the epoxy resin affects its ease of application and the ability to fill gaps and voids in electronic assemblies. Low-viscosity materials are suitable for potting and encapsulating, while higher-viscosity resins may be better for adhesive applications. Selecting the appropriate viscosity ensures proper coverage and effective heat transfer.
Environmental Challenges
Thermal management materials must withstand environmental factors such as humidity, moisture, temperature fluctuations, and chemical exposure. This ensures long-term reliability and performance in harsh conditions. Epoxies are resistant to many chemicals and are therefore suitable in many harsh environmental conditions. The epoxy must resist the environmental contaminants that it will be exposed to in its operating environment.
United Resin’s Range of Thermal Management Materials
United Resin offers a comprehensive selection of epoxy resin systems for thermal management in electronic applications to achieve superior performance for electronic components, devices, and applications. Our signature products include:
EL-Cast VFR Plus
United Resin’s EL-CAST VFR PLUS is our latest innovation, emphasizing fire safety. This filled, low-viscosity, high-temperature potting and encapsulating resin provides superior flame resistance. With certain hardeners, it achieves a 0-second AfterFlame and has no flame drip, making it safer in high-risk environments. It is also easy to mix, simplifying the preparation process.
EL-Cast 1-F-5 TAB VO
This is a high-viscosity, high-temperature, one-component system designed with low odor and provides good air release, improving the working environment. This resin also provides a high-gloss finish and good thermal conductivity, and is commonly used for encapsulating “chip-on-board” applications.
EL-Cast 1-F-5 TAB, TAB SR
These medium-viscosity electronic resins can function as a one- or two-component system. They offer excellent thermal conductivity, high-temperature resistance, good chemical resistance, and excellent adhesion at high temperatures. These resins can be cured at room temperature or with heat and are suitable for transformers, filters, coils, and any applications where heat cure is feasible.
EL-Cast 760
EL-CAST 760 is a medium-viscosity, high-temperature potting and encapsulating resin with excellent impact and thermal shock resistance. It also offers high thermal conductivity and deflection temperature, making it well-suited for control units, transformers, noise filters, and similar applications.
E-CAST F-82
This unfilled, low-viscosity resin is known for its high-strength adhesion and good air release. It is ideal for intricate applications such as circuit boards and other detailed tasks.
Unlock Superior Thermal Management With United Resin
Look to United Resin as a trusted source of epoxy resin systems. We have an extensive portfolio of products for potting, encapsulating, and casting electronic components. They offer excellent thermal management, as well as excellent adhesion to various substrates, including PTFE, nylon, acetal, ceramics, and stainless steel. All our materials are non-hazardous, REACH/RoHS compliant, and solvent-free.
With over 50 years of industry expertise, we are dedicated to creating epoxy resin formulations that meet your unique requirements. Experience consistent quality and performance in every application with our wide portfolio of products, our ability to create customized solutions for our customers’ needs, and our trusted manufacturing processes.
Contact us to find the solution for your thermal management needs, or request a quote today.
The information presented herein is intended for general background and informational purposes only and not as advice about any product, application, or process. We encourage you to contact us for information concerning your specific needs and requirements and to discover how United Resin may assist you.
A Primer on One-Component Epoxy and its Advantages in Industrial Applications
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Epoxy resins are vital in many industries because of their strong bonds and durability. Notably, there has been a trend toward adopting one-component epoxy systems because they are more convenient and can be as effective as traditional two-component options. Their pre-mixed formulation eliminates complex blending, streamlines processes, and improves efficiency in various industrial sectors.
This blog delves into the several advantages of using single-component epoxy in industry. We will also explore how these epoxies enhance production processes and product quality.
The Composition of Epoxy Adhesives
Epoxies are two-part thermosetting polymers that consist of a resin and a hardener. A chemical reaction, polymerization (curing), is initiated when the resin is mixed with a hardener (sometimes referred to as a catalyst). Epoxy resins form crosslinks during this process, creating a three-dimensional polymer network of great mechanical strength. After mixing the two components, during the curing process epoxy passes from the liquid state, through a gel state, to a fully hardened solid-state to form a rigid, durable material. As a result, they can be used as adhesives, coatings, and encapsulants in a wide range of important applications. Epoxy resins are known for their excellent strength, adhesion, chemical resistance, and mechanical properties.
Epoxy resin systems are typically sold in kits that contain the two components of resin and hardener in separate containers. The chemical process of polymerization requires proper mixing of the two components. It is critical that the mixing process combines the resin and hardener in the correct ratio as specified by the manufacturer, using proper mixing techniques, to achieve the desired properties of the system. Some formulations, however, are one-component systems, consisting of a pre-mixed formulation with the base resin and hardener or catalyst already incorporated in the system. One-component epoxy formulations avoid potential problems of mixing in an incorrect ratio or not mixing the components properly. As pre-mixed formulations, they require no mixing of the two components prior to use. An understanding of both two-component epoxy systems and one-component epoxy enables an informed selection of the best type to achieve the optimal results for an application.
The Chemistry of One-Component Epoxies
One-component epoxy systems are pre-measured and pre-mixed formulations including the resin and hardener, and thus do not require measurement of resin and hardener and do not require mixing before use. They are formulated to cure upon exposure to a trigger, typically heat with a specified temperature. The chemistry of these systems involves epoxy resins and latent curing agents that remain stable at room temperature but react when exposed to elevated temperatures. Latent curing agents are formulated to remain inactive or have limited reactivity at ambient temperatures and activate only when heated. Upon exposure to heat, these agents decompose or become reactive, thereby initiating polymerization, or the curing process. This leads to the formation of crosslinks, creating a three-dimensional polymer network, resulting in a solid, thermoset polymer with excellent mechanical properties and chemical resistance. The technical data sheet for the material will provide information and guidance on the temperature and cure time. Heating sources include conventional ovens, infrared lamps, hot air guns and induction curing. One-component epoxy has excellent bonding strength, is highly durable with excellent resistance to chemicals, heat, and thermal shock and stress, and has good electrical insulation and electrical resistance qualities. One-component epoxy can be formulated with a wide range of mechanical properties and viscosity. Modifiers and fillers may be added to improve the mechanical properties, thermal stability, and handling characteristics of the epoxy. One-component epoxy is shipped frozen. For stability and consistency, one-component epoxy should remain frozen until ready for application use. When stored at the proper temperature the shelf life of one-component epoxies is excellent. Generally, the specific application will be informative as to whether a two-component or one-component epoxy is selected.
The Key Advantages of One-Component Epoxies
1. Ease of Use
One-component epoxy is easy to use in industrial settings. Its simple application process requires minimal training and is accessible to operators with varying expertise levels. It eliminates the need for mixing, avoids errors in measuring quantities of resin and hardener, and eliminates problems from poor mixing techniques. Since no mixing or complex preparation is needed, workers may apply it quickly and efficiently. It also eliminates pot life issues.
2. Cost-Effectiveness
Single-component epoxy adhesive offers cost-effectiveness by reducing labor and equipment costs associated with mixing and application. With its ready-to-use formulation, labor hours spent on mixing time and related preparation are minimized. Since mixing is unnecessary, it does not require any special metering or mixing equipment. Its strong bonding strength and durability also contribute to long-term cost savings by mitigating the need for repairs or replacements. By not having to mix, there is less waste generated in the preparation process. Many one-component epoxies have a long shelf life and can be stored for extended periods without degradation, thereby enhancing inventory management.
3. Reduces Air Entrapment
One-component epoxy is formulated to reduce air entrapment through various mechanisms, which contributes to a stronger bond. Without manual mixing, the risk of external air introduction is greatly reduced, resulting in a more reliable and durable adhesive that is smooth and bubble-free. A seamless application process minimizes the need for post-mixing degassing or vacuuming the pre-mixed epoxy.
4. Enhanced Safety
One-part epoxy offers enhanced safety benefits compared to traditional two-part systems. With no need for mixing, there is reduced exposure to the component chemicals and the exothermic reaction of mixing, which enhances workplace safety.
5. Consistent Performance
With the resin and hardener pre-measured in the system and no mixing process, single-component epoxy provides consistent performance batch after batch, assuring higher product quality. Since the formulation is controlled by the manufacturer, one-part epoxy offers predictable results with less chance of human error during preparation, leading to greater consistency in production processes.
6. Exceptional Mechanical Strength, Chemical Resistance and Thermal Stability
Single-component epoxy adhesives boast superior mechanical strength and resistance to various environmental factors, such as chemicals, mechanical stress, and heat. Because they can adhere to a wide range of substrates, they find extensive applications in the automotive, aerospace, electronics, and medical industries.
Applications of One-Component Epoxy Across Various Sectors
Whether a one-component epoxy or two-component epoxy system is selected in the end depends on the specific application. One-component epoxies have many important applications across a variety of industries due to their ease and efficiency of use, strong adhesion and other properties, and durability. Listed below are some of the key industrial applications of one-part epoxy:
Manufacturing
Single-component epoxy is commonly used for bonding metal parts, which provides secure and durable joints essential for the structural integrity of machinery and equipment. These adhesives are employed in securing inserts or fasteners, ensuring a reliable connection and improved aesthetics without mechanical fastening methods.
Aerospace
In the aerospace industry, one-component epoxy is used to bond and assemble composite materials, metals and other substrates used in aircraft structures, providing high strength and durability. As a surface coating, it can protect aircraft parts from environmental damage, wear and corrosion. It is used also as a sealant to prevent moisture ingress and improve structural integrity, and as a potting and encapsulation material to protect sensitive electronic components.
Automotive
In the automotive industry, one-component epoxy is used to attach trim pieces that provide a secure and aesthetically pleasing finish to vehicle interiors and exteriors. These are also vital in bonding plastic, metal, or composite parts, guaranteeing the structural integrity of components such as body panels, bumpers, engine parts, and other automotive assemblies.
Electronics
One-part epoxy encapsulates and bonds a variety of electronic components, protecting them against moisture, dust, and mechanical stress. It is also employed in sealing circuit boards, which prevents contaminants from damaging sensitive electronic components and thus improves the lifespan of electronic devices. One-part epoxy is used widely for bonding surface mount devices to printed circuit boards. Additionally, it is used for potting connectors that secure connections between electronic components and cables. One-part epoxy offers a number of excellent properties for electrical encapsulation and potting applications, including flame retardancy, excellent thermal management, low dielectric properties, flexibility, and low shrinkage.
Medical
One-part epoxies are used extensively in the medical industry in a variety of applications, including, bonding components of medical devices, encapsulating medical electronics for protection from moisture, chemicals and physical stress, assembling medical instruments, and coating medical devices.
Choose United Resin for Superior Adhesive Formulations and Ask Us About our One-Component Epoxies
United Resin specializes in providing tailored epoxy solutions with our extensive range of epoxy systems, including one-component systems. With over 50 years of industry expertise, we are dedicated to crafting epoxy resin formulations that meet your unique requirements. Experience consistent quality and performance in every application with our wide portfolio of products, our ability to create customized solutions for our customers’ needs, and our trusted manufacturing processes.
Contact us to explore our top-tier epoxy resin systems and find the perfect solution for your needs, or request a quote today.
The information presented herein is intended for general background and informational purposes only and not as advice about any product, application, or process. We encourage you to contact us for information concerning your specific needs and requirements and to discover how United Resin may assist you.